Testing & Test equipment
Automated ICT/FCT tests
Automated test systems
In-process control of THT assembly
JM elektronik’s process team develops documentation that clearly describes the requirements for THT assembly, especially covering manual assembly.
The most experienced employees, the leaders, take care of the whole process, including training of employees in reading the documentation, introduction of products new to the assembler and visual inspection to ensure the correctness of operation.
We have introduced traceability support in the company, a system solution supported by software, so that particular component deliveries, particular stages of assembly and tests are registered from the beginning of the production process.
SPI and AOI 3D
Despite making best efforts for correct paste application, high precision of component placement on a PCB and precise temperature control in reflow oven, a NOK board may be assembled.
We use SPI in the solder paste application control process at JM elektronik – a tool that enables automatic 3D inspection of the PCB solder paste volume.
After surface mount assembly, we use post reflow automated optical inspection (AOI), which detects rotation, polarity, bridging, missing components, among others – and also performs measurement and inspection in the 3D to detect raised leads, raised components, and tombstone effects for chip-type components.