That is when it is worth digging deeper – applying VAVE (Value Analysis and Value Engineering). This enables a methodical, objective approach to identifying what actually drives costs in a product.

It is worth clarifying this: VAVE is often confused with traditional cost cutting, i.e. pressuring suppliers to lower prices or desperately searching for the cheapest substitutes. Such an approach is short-lived – it usually results in quality issues or disrupted supply chains.

VAVE works completely differently. The starting point is not the price of a specific capacitor or connector, but the function that a given component performs in the device. The question, therefore, is not: “how can we buy this more cheaply?”, but: “are we implementing this functionality in the most effective way?”.

In practice, this means we do not start by analysing the BOM. We start by understanding what is essential in the product, and what merely results from design conventions, the device’s development history, or decisions made under entirely different market conditions.

If we take an honest look at most electronic projects, high costs rarely result solely from market conditions. Much more often, they are the outcome of specific engineering decisions:

• Oversizing: Using components with specifications significantly higher than required by the device’s actual operating environment.
• Lack of standardisation: Situations where a single project includes several almost identical components from different manufacturers, fragmenting purchasing volume.
• Legacy design decisions: PCBs that are electrically sound but complex and expensive to assemble (e.g. requiring additional manual operations).
• Processes: Solutions that worked well at the prototype stage but become problematic at a scale of 10,000 units, generating unnecessary labour hours.

These are not mistakes – they are a natural stage in every product’s evolution. The problem arises when no one revisits these decisions to reassess their business case a year or two after the product’s launch.

In a partnership with an EMS provider, the role of the factory does not end with assembly alone. As an EMS provider, we have access to data from many markets, experience from hundreds of projects and – most importantly – we view your product from a different perspective than the R&D team.

The real value of VAVE lies at the intersection of three areas:

1. BOM analysis: Knowledge of component availability and lifecycle.
2. DFM/DFA (Design for Manufacturing/Assembly): Verifying whether the design is suitable for machines and automated processes.
3. Process optimization: Understanding how a minor design change can eliminate a costly manual operation on the production line.

The VAVE process rarely involves a major overhaul. It is more a series of small, logical steps.

Sometimes we start by replacing a component with one that is cheaper and more readily available while maintaining the same specifications. On other occasions, the greatest benefit comes from simplifying the layout, enabling the use of a smaller, less expensive PCB. It also happens that changing the assembly technology for a single component allows us to reduce the product’s throughput time on the production line by 15%.

Individually, these changes may seem cosmetic. Taken together, however, they can reduce the product’s cost by several percent – while maintaining (or even improving) its reliability.

The biggest mistake is treating VAVE as a last resort, something to reach for only when the product ceases to be profitable. It works, but it is too little, too late.

VAVE should be a cyclical process. A product has a lifecycle: prices, technology availability and user requirements change. What was optimal two years ago may now require adjustment. Companies that permanently schedule VAVE reviews in their collaboration calendar with EMS providers have a significant advantage. Their products are continuously fine-tuned to the market, rather than only being improved when the problem has already become critical.

Ultimately, it all comes down to the numbers. VAVE delivers measurable results: lower cost of goods sold (COGS), greater flexibility in procurement and reduced risk of downtime.

But control is just as important. Knowing exactly what makes up your product’s cost and where its reserves lie changes the way you make business decisions. It allows you to react more quickly to competitors’ moves and pursue a more informed pricing strategy.

In a well-managed production process, cost is not accidental. It is the result of informed choices. VAVE is simply a tool that helps you make those choices better.

Artykuł VAVE at EMS – where do product costs really arise? pochodzi z serwisu JME.

In modern contract manufacturing, there is no single “best” soldering method. Instead, there is a combination of technologies that is optimal for a specific project – its BOM, PCB geometry, component sensitivity, and planned volumes.

Below, we show how EMS providers approach the selection of soldering technology in practice and when a given method truly makes business sense.

Reflow soldering is today the foundation of SMT assembly. A board with applied solder paste passes through an oven with a controlled temperature profile – from preheating, through flux activation, to the reflow phase and controlled cooling. This technology scales well for both prototypes and series production, provided the profile is correctly matched to the thermal mass of the PCB and the types of components used.

Reflow makes the most sense where SMT components dominate, volume scalability is planned, and the design includes packages such as BGA, QFN, or SiP modules. With a well-designed PCB, it delivers high repeatability and stable quality.

However, it is not the optimal choice for boards with highly uneven thermal mass, extremely thermally sensitive components, or prototype designs in which the layout changes from iteration to iteration. In such cases, problems such as tombstoning, voiding, or component shifting usually result not from the technology itself, but from improper profile engineering and PCB design.

In EMS practice, reflow issues more often stem from an incorrect thermal profile than from the technology itself.

Low-temperature soldering uses alloys with melting points in the range of 138–175°C instead of the classic SAC305. Its main advantage is reduced thermal stress, which is important for thin laminates, dense modules, and sensitive BGA packages.

LTS can be highly effective in high-density designs and where a conventional reflow profile causes component deformation. At the same time, it is a technology with a narrow process window, sensitive to heating rates and time above liquidus.

It is not a safe choice for hybrid designs (mixing SAC and LTS), in situations with limited material availability, or in applications where joint mechanical strength is critical – for example, in devices exposed to vibration, shock, or intensive temperature cycling.

Low-temperature soldering can rescue thermally sensitive designs, but it is not a substitute for SAC305 in high-reliability applications.

Wave soldering remains the basic technology for assembling through-hole components (THT) in series production. The PCB passes over a pot of molten solder, which simultaneously forms all joints. This solution is highly cost-effective for medium and large volumes.

Wave soldering works best in designs dominated by THT, with a stable layout and well-prepared DFM. Under these conditions, it ensures low unit costs and high repeatability.

Problems arise when attempting to use it for densely populated boards, double-sided SMT assemblies, or projects with high design variability. The lack of pallets, large mechanical tolerances of connectors, and mismatched PCB geometry lead to bridging and unstable joints. In such cases, instead of helping, wave soldering generates defects.

Selective soldering uses a mini-wave and precise flux application for point soldering of selected THT components. This technology is designed for mixed SMT + THT boards and High-Mix Low-Volume environments.

Selective THT provides much greater quality control than wave soldering and allows only those components that require it to be soldered. It works well where the volume is too high for manual assembly but too low or too variable for classic wave soldering.

However, it is not optimal for very large volumes or where cycle time is absolutely critical. In such cases, wave soldering remains the more economical solution.

A soldering robot is a station for point THT soldering, in which the soldering head is numerically controlled along the XYZ axes. It allows precise control of temperature, contact time, and solder amount for individual solder joints.

In practice, a soldering robot makes sense in EMS for short but repeatable series after the NPI stage, when the design is already preliminarily stabilised and the quality of manual soldering begins to vary between operators. It is also useful for hard-to-reach solder joints.

However, it is not the right choice for very small volumes, frequent PCB layout changes, or large mechanical tolerances of boards. The cost and time required for programming often exceed the time needed for manual soldering. With a larger number of THT points, the robot quickly becomes a bottleneck in the process.

In EMS, a soldering robot is not a volume solution, but a transitional tool between manual THT and selective mini-wave soldering.

Manual THT assembly is soldering performed by an experienced operator using a soldering station, flux, and solder wire, without full automation of the process.

In the Polish cost environment, manual soldering remains economically justified in many low-volume projects. It works particularly well for prototypes and NPI, for PCBs unsuitable for automation, for components with large mechanical tolerances, and where speed of response is critical – for example, for series of a few to a dozen units “needed yesterday”.

Of course, it has its limitations: quality depends on the operator’s experience, repeatability is lower than in automated processes, and scalability quickly diminishes as volumes increase.

In the Polish cost environment, manual THT soldering often provides a better cost–time–quality balance than partial automation.

Ultra-precision soldering is used for extreme miniaturisation – 01005, μBGA, QFN, microLED components, and SiP modules. It requires the use of Type 6 and Type 7 solder pastes and advanced SPI and AOI control.

This is an area with a very narrow process window, where the experience of process engineers, precise paste printing, and a stable reflow profile are critical. It enables extreme miniaturisation, but does not tolerate mistakes.

In EMS PCB assembly practice, most soldering problems do not result from “bad technology”, but from a mismatch between the technology and the project’s real requirements.

One of the most common cases is BGA joints cracking after several temperature cycles. Usually, the issue is not the component itself, but an overly aggressive reflow profile or the failure to use low-temperature soldering with thin laminates. In such designs, classic SAC305 is simply too thermally “hard”.

Another recurring problem is bridging and unstable joints in THT components. This is most often caused by attempting to force wave soldering on boards that were not designed for it. Dense component placement, large mechanical tolerances of connectors, or the lack of pallets mean that instead of helping, wave soldering generates defects. In such cases, manual THT or selective soldering produces a much better end result.

We also frequently encounter disproportionately high costs for very small NPI series. This happens when automation is launched for batches of only a few to a dozen units, requiring lengthy setup – programming a soldering robot or retooling a selective wave system. In the Polish cost environment, manual soldering is simply faster and cheaper in such projects.

A separate issue is low quality repeatability in short runs. Here, the problem is both manual soldering performed by different operators and switching to a soldering robot too early when the design is still unstable. In practice, a phased approach delivers the best results: manual THT at the NPI stage, a robot only after the layout has stabilised, and selective wave soldering when entering serial volumes.

Finally, many customers complain about long time-to-market when design changes occur. This is most often due to an overly rigid production process that requires reprogramming of automation each time. Maintaining manual and semi-automated THT as a flexibility buffer allows rapid response to design changes without blocking production.

The choice of soldering technology directly affects unit costs, product reliability in the field, the ability to scale production, and time to market.

That is why, in a professional EMS environment, the process always starts with an analysis of the BOM, PCB geometry, quality requirements, and planned volumes – not with the question, “What machine do we have on the shop floor?”

At JM elektronik, we treat the selection of soldering technology as a business decision, not a showcase of our machine park. Our goal is not to “automate everything”, but to find the right balance between cost, quality, flexibility, and scalability.

We start each project with an analysis of the BOM, PCB geometry, mechanical tolerances of components, thermal sensitivity of circuits, and planned volumes. The product life cycle is equally important – working with a prototype is very different from working with a mature product that returns every month in the same batch size.

In practice, we use reflow soldering as the basis for SMT assembly, wave soldering for serial projects dominated by THT, and selective mini-wave soldering for mixed SMT + THT boards. We also maintain manual THT assembly, which in the Polish cost environment remains a rational choice for NPI, prototypes, and “difficult” boards unsuitable for automation. We treat soldering robots as a transitional solution – between manual THT and selective wave soldering – used when the design is already preliminarily stabilised and the quality of manual soldering begins to fluctuate.

We do not offer vapour phase technology because, under Polish market conditions and typical EMS volumes, it is rarely economically justified. Instead, we optimise reflow profiles and, where appropriate, use low-temperature soldering for thermally sensitive components.

In practice, this means that we do not push automation where manual assembly offers a better cost–time–quality balance. For us, a well-chosen process is one that can be repeated in six months without changing the technology and without increasing unit costs.

This approach allows us to shorten time-to-market for NPI, reduce soldering defects in high-density designs, and enable customers to scale production without changing their EMS partner.

If your board combines SMT, THT, and thermally sensitive components, undergoes frequent design changes, or is to be produced in short, repeatable series, it likely requires a non-standard selection of soldering technology.

Contact us – we will analyse your project and propose a production process tailored to the cost and volume realities of your business before production begins.

Artykuł How to Choose Soldering Technology in EMS? A Practical Guide for R&D and Purchasing Teams pochodzi z serwisu JME.

Understanding how Gerber files are used – and why their completeness is critical – helps customers avoid issues from the very beginning and ensures a seamless transition from design to a fully manufactured PCB.

Gerber files are the standard data format used in the production of printed circuit boards (PCBs). The format originates from Gerber Systems Corp., the company that first introduced it. These files contain comprehensive information on the placement and geometry of PCB features such as pads, traces, solder masks, and silkscreen layers. Their primary purpose is to translate a design created in CAD software into manufacturing instructions that PCB fabrication facilities can interpret.

In a typical PCB layout, each layer is exported as a separate Gerber file. In more advanced designs, however, multiple layers may be combined to generate additional documentation, such as fabrication drawings or assembly files.

Gerber data is stored in ASCII text format, meaning each file includes configuration parameters, hole definitions, aperture descriptions, coordinate data for all elements, and commands that govern how features are drawn. Gerber files can be opened in dedicated viewer applications that render a graphical representation of the PCB – similar to what is shown in CAD tools. This allows manufacturers to perform a preliminary review and run DFM (Design for Manufacturing) checks, including verification of track spacing and clearances.

Gerber files serve as the primary communication interface between PCB designers and manufacturers. Without them, design data would remain locked in proprietary software formats, preventing its direct use in fabrication processes.

Gerber files present design intent and detailed information regarding trace geometry, pads, solder masks, and all remaining PCB layers in a clear, unambiguous, and tool-agnostic format. This eliminates the risk of misinterpretation and ensures the faithful execution of the original design.

Gerber files play a pivotal role in automated PCB production, where each board layer must be reproduced with micrometer-level precision. They act as machine-readable instructions for CAM systems, lasers, CNC drilling machines, and SMT assembly lines, enabling the physical creation of an electronic product. They are also integral to quality assurance systems such as AOI and AXI, where they are used to generate reference models that help detect deviations from the intended design.

Without the Gerber standard, the current scale of electronics manufacturing – from rapid prototyping to mass production – would simply not be feasible.

From the perspective of EMS providers, Gerber files constitute mission-critical production documentation. They are used to plan technological processes, estimate costs and delivery timelines, and verify whether a design is compatible with available manufacturing capabilities. Any deficiencies, such as missing layers or incorrect file structures, may result in production downtime, engineering changes, or material wastage.

Therefore, proper preparation of Gerber files is a fundamental prerequisite for project success. It ensures a smooth transition from a designer’s concept to a physical PCB – the core building block of modern electronic products.

The earliest commonly used Gerber format was RS-274-D, which contained only XY coordinates along with basic drawing and flash commands. Aperture definitions had to be assigned separately, increasing the risk of errors and limiting automation.

This format was later replaced by RS-274-X (often referred to as “Gerber X”), which integrates aperture definitions and other key parameters into each file, eliminating manual configuration and streamlining both design and production workflows. Today, it is the standard format used in PCB design software, accounting for the production of approximately 90% of all PCBs currently designed worldwide.

The most recent evolution is Gerber X2, which supports additional metadata, such as pad functions, layer types, and impedance-related parameters, further enhancing clarity and traceability during manufacturing.

Despite these developments, the Gerber format remains compatible with both traditional photoplotters and modern laser direct imaging (LDI) systems, reaffirming its position as the industry standard for PCB production documentation.

The exact procedure depends on the CAD platform used. Below are examples for common tools.

1. KiCad

In KiCad 7, generating Gerber and drill files involves the following steps:

1. Run a design check – perform a DRC (Design Rule Check) before export.
2. Select layers – choose all layers required for fabrication, such as F.Cu, B.Cu, solder mask layers, and silkscreen.
3. Adjust Gerber settings – enable options such as Plot reference designators, Subtract solder mask from silkscreen, and the recommended Protel file extensions.
4. Generate files – click Plot, then generate drill files (Generate Drill Files) and, optionally, a drill map.
5. Verify output – review the exported files in a Gerber viewer to ensure that board outline, holes, and layers are correctly represented.
6. Compress files – package all output files into a single .zip archive before submitting them to the manufacturer.

2. Altium Designer

1. Create a new OutJob file and select the required manufacturing outputs.
2. Choose the desired layers and the RS-274X or Gerber X2 format.
3. Configure export parameters, including units, templates, and layer sets.
4. Click Generate and verify the resulting files.

3. Autodesk Eagle

1. Confirm correct placement of silkscreen on the top and bottom layers.
2. Open the CAM Processor and export Gerber files from the .brd file.
3. Configure layer visibility and drilling options.
4. Validate the generated output and compress the files into a .zip archive before submission.

Gerber files are not delivered as a single document but as a collection of separate files, each representing a specific layer of the PCB design. The function of each layer is defined by its file extension. For instance, GTL refers to the top copper layer, GBL to the bottom copper layer, GTS and GBS to the solder mask layers, while GTO and GBO denote the silkscreen layers. Drilling information is typically stored in TXT or DRL files, and the GBX extension may appear in more advanced designs where a layer contains data that does not clearly fall into standard categories.

Although most CAD tools follow similar naming conventions, designers should always verify that the manufacturer understands the meaning assigned to each layer. Every file is processed by the CAM system, and any incorrect layer assignment can result in severe production errors that cannot be corrected once manufacturing begins.

Gerber file verification is a critical step before releasing a design for production, as it allows for the detection of errors that could halt the manufacturing process or lead to defective PCBs. The objective of this review is to confirm that all layers are complete, correctly named, and properly associated with their respective extensions, and that they contain all the data required for solder mask, silkscreen, drilling, and assembly operations. It is equally important to ensure that the file format complies with the manufacturer’s specifications so that CAM systems can interpret the data without ambiguity.

Verification is performed using dedicated Gerber viewer software—such as Gerbv, CAM350, or Ucamco Gerber Viewer—which enables visual inspection of each layer and detailed analysis of the board’s geometry. These tools help identify discrepancies such as incorrectly assigned paste layers, missing solder mask data, or improper hole alignment. Proper verification prior to submission eliminates issues that could later result in material waste, production delays, or the need to restart the manufacturing process.

Gerber files ensure that PCB manufacturers can accurately reproduce a design, prepare tooling for fabrication and assembly, and perform quality checks. Despite continuous advancements in electronic design and manufacturing technologies, Gerber remains the principal format for exchanging PCB production data – fully compatible with traditional laser plotters, LDI machines, and modern direct imaging solutions.

A thorough understanding of how to generate and validate Gerber files is essential for PCB designers, as it helps prevent manufacturing errors and supports the delivery of high-quality, reliable boards.

Artykuł Gerber Files: A Guide for Customers pochodzi z serwisu JME.

In this article, we highlight the most common PCB design mistakes and provide practical guidance on how to avoid them.

Production documentation is essential for communication between the designer and the EMS partner. Missing files – such as Gerber files, the BOM, pick-and-place files, or assembly drawings – or inconsistent labeling, such as mismatched item numbers between the schematic and the PCB, can slow down assembly preparation, causing delays and additional costs.

Using standardized documentation practices, thoroughly checking file consistency, and generating documentation directly from CAD software (e.g., Altium, KiCad) can prevent errors. Including a PDF view of the board, a layer diagram, and a component table further ensures clarity.

The BOM is crucial for component procurement. Missing manufacturer part numbers, tolerance values, or package types can result in incorrect orders, production delays, and discrepancies between prototypes and final products.

Maintaining a detailed and up-to-date BOM that includes reference designators, component names, values, tolerances, packages, manufacturer part numbers, and possible substitutes is essential. Generating the BOM directly from the CAD system and applying version control helps maintain accuracy.

Sometimes the footprint, meaning the pad layout and dimensions, does not match the actual component. Even small discrepancies, such as different lead spacing, can prevent proper placement, requiring manual adjustments or, in extreme cases, scrapping entire boards.

Using component libraries from trusted sources, such as manufacturers or certified databases, and verifying footprint dimensions against datasheets during the design stage prevents these issues.

Unclear markings for diodes, electrolytic capacitors, or integrated circuits can lead to orientation errors. Pick-and-place machines require accurate information about pin 1 or component polarity; missing or ambiguous markings increase the risk of incorrect assembly or necessitate additional consultation with the designer.

Including clear assembly drawings and marking components with defined rotation ensures correct placement.

Holes in THT (Through-Hole Technology) pads that are too small can prevent proper pin insertion, and solder may not fill the hole completely, reducing connection quality.

The hole diameter should be at least 0.2–0.3 mm larger than the lead, and PCB manufacturer specifications for minimum drilling tolerances must be observed. Creating a test panel to measure actual hole dimensions after metallization is recommended.

If a design does not meet the minimum spacing requirements specified by the manufacturer, such as 6 mils for both track width and spacing, short circuits may occur, and production costs may increase significantly. In extreme cases, the board may require an HDI process, which substantially raises manufacturing costs.

Setting DRC (Design Rule Check) rules according to the manufacturer’s parameters from the start of the design and using CAD tools to detect violations ensures compliance before exporting Gerber files.

Fiducials are essential markers that allow pick-and-place machines and automated optical inspection (AOI) systems to determine board orientation. Without them, the EMS partner may need to add fiducials manually or adjust the design, leading to delays and additional costs.

Panelization is usually performed by the EMS partner according to their process requirements, including adding a frame (typically 5–10 mm wide) and at least three fiducials in the corners of each module.

Test points are crucial for quality control and functional testing, including ICT (In-Circuit Testing) and FCT (Functional Circuit Testing). Their absence complicates diagnostics, prolongs testing and servicing, and sometimes necessitates temporary wire soldering, which increases costs.

Including test points for critical signals, power supply lines, and ground connections at the design stage ensures easy access for test probes, ideally with a minimum diameter of 1 mm. Some CAD tools can generate these points automatically.

Components placed too close to each other or near the edge of the board may interfere with pick-and-place nozzles, soldering tools, or the enclosure. Insufficient spacing also complicates rework and inspection. Placing components less than 3 mm from the board edge increases the risk of damage during depanelization.

Maintaining minimum distances between SMD components and leaving 3–5 mm from the board edge, along with performing 3D CAD analysis, helps prevent interference with the enclosure and assembly tools.

Choosing unusual laminate thicknesses, such as 0.9 mm, or suboptimal stack-ups can create assembly difficulties and increase production costs.

Consulting the PCB manufacturer during the design stage and using standard stack-ups, such as a 4-layer FR4 configuration, ensures manufacturability. If a specific stack-up is required, verifying its availability and including the specifications in the PCB documentation is recommended.

If component markings or values overlap pads, soldering may be hindered and solder paste contamination may occur. Conversely, missing markings complicate service and troubleshooting.

Checking silkscreen placement using CAD tools and maintaining a minimum distance from pads, typically 0.2 mm, ensures readability. Using clear fonts and avoiding overly small markings improves overall legibility.

Insufficient space between SMD pads can prevent proper application of the solder mask, resulting in solder bridges during assembly and potential short circuits.

Using manufacturer-recommended footprints, applying solder mask expansion in CAD tools, and verifying compliance through DRC checks prevent these issues and reduce manual rework.

PCB design requires precision, experience, and thorough knowledge of manufacturing standards. Even small errors in documentation, footprints, or component placement can significantly impact both cost and reliability. Close collaboration between the designer and the EMS partner, adherence to DRC rules, verification of data consistency, and early consideration of assembly and testing requirements are key to successful production.

Conscious and careful design not only prevents costly corrections but also ensures quality, stability, and professionalism throughout the manufacturing process. At JM Elektronik, we assist with comprehensive design verification, documentation optimization, and board preparation for efficient assembly.

Reduce the risk of errors by designing your PCB in collaboration with EMS experts.

Artykuł How to avoid the most common PCB design mistakes? Practical tips for better PCB design pochodzi z serwisu JME.

At JM elektronik, we carefully analyse each stage of the process – from PCB design and component sourcing to assembly and testing – to ensure our customers receive the best value for their investment. In this article, we present the most important factors affecting PCBA production costs and explain how we support our partners in optimisation. 

Before the first component reaches the production line, costs begin to build up at the PCBA design stage. The more complex the design, the higher the price. A multi-layer board with thin tracks, manufactured from a specialised laminate designed for high frequencies, involves completely different expenses than a standard double-sided FR-4 board. Each additional feature, such as extra layers, plated edges, or gold-plated connectors, automatically increases the cost of production. 

The size and layout of the PCB itself are equally important. Standard production panels have fixed dimensions, so an unusual board shape or a format that prevents full utilisation of the available space leads to material waste and therefore raises the unit cost. 

Another factor influencing the budget is labour-intensive assembly. Introducing advanced components, often necessary in innovative designs, requires more precise and expensive machines and sometimes mandatory X-ray inspection. Furthermore, any operations that cannot be automated require additional manual work or the use of dedicated tools, which further increases total production costs. 

Electronic components often represent the largest share of the production budget. Their price depends on the type of components used, their technological complexity, and the current market situation. 

The prices of microcontrollers, memory chips, and even basic capacitors can rise sharply due to global shortages. Another challenge involves production and delivery lead times, which may increase as a result of unexpected disruptions. The market experienced this particularly during so-called allocation periods, which is why it is so important to secure a stable supply chain in times of dynamic fluctuations in semiconductor availability. 

Order size also matters – for smaller quantities, especially when ordered below the factory packaging size, the unit price can increase significantly, illustrating the classic example of economies of scale. Final costs are also affected by factors such as packaging methods: if the packaging is unsuitable for automated assembly, manual preparation becomes necessary, which generates additional expenses. 

Optimising PCBA costs is not about finding savings at each stage of production individually, but rather about taking a strategic approach to the Total Cost of Ownership (TCO). TCO includes all expenses related to a project or product throughout its lifecycle – not only the purchase price, but also costs of design, production, logistics, maintenance, testing, servicing, and risk management. 

The greatest potential for cost reduction appears before production even begins – at the design stage. This is why applying Design for Manufacturing (DFM) principles and involving an EMS partner early in PCB development are crucial. 

Standardisation is a key element of cost control. Choosing the same resistors, capacitors, and diodes across the design simplifies procurement, reduces machine setup times, and minimises the risk of errors. It is also advisable to design boards to fit standard production panels, which maximises material utilisation and reduces waste. 

The cost of PCBA production also depends largely on the assembly technology used. SMT (surface-mount technology) is faster, highly automated, and more cost-effective for larger production volumes. THT (through-hole technology), on the other hand, is more time-consuming and often requires manual labour, which increases the price. For highly complex projects, we use hybrid solutions combining both approaches. 

At JM elektronik, our engineers support customers by recommending minor design adjustments that can significantly simplify assembly and reduce final costs. We have described this topic in more detail in our article on DFM analysis>>

Production strategy also plays a significant role. Prototype manufacturing is relatively expensive because it requires individual line preparation, additional testing, and full process configuration. In the case of small series, the unit cost also remains high, but with larger orders, it is spread across a greater number of units, which significantly reduces the price. 

Whenever possible, it is worth simplifying processes – for example, by consolidating smaller orders into larger batches, which allows for more efficient use of economies of scale. 

The cooperation model with an EMS provider should also be carefully chosen. For large and stable projects, the turnkey model, where the EMS partner is responsible for the entire process, is usually the most cost-effective. However, for prototypes or when the customer provides their own components, a consignment model may be a better solution. 

Testing is another important factor. Instead of aiming for maximum inspection in every case, it is worth assessing the optimal level of testing for a given product – sometimes AOI (Automated Optical Inspection) is sufficient, while for medical devices, full functional and high-voltage testing is often necessary. 

Investing in a well-designed process that prevents errors is often more cost-effective than detecting them at later stages when corrections become significantly more expensive. 

The choice of production location has a significant impact not only on cost but also on quality and process security. Manufacturing in Asia may initially seem cheaper, but it often involves limited quality control, longer delivery times, and a greater risk of intellectual property infringement. 

Looking at the process as a whole, a low unit price does not always translate into real savings, as potential rework, complaints, and delays can substantially increase the final project cost. 

Short lead times require additional resources, both for component procurement and production line scheduling, and they limit opportunities to optimise purchasing strategies, which negatively impacts final costs. 

That is why careful planning is so important. Together with our customers, we prepare tailored production schedules to minimise the costs of urgent orders and avoid unnecessary risks related to time pressure. 

The cost of electronics production results from a combination of many interrelated factors: design, components, assembly technology, batch size, testing requirements, production location, and certifications. 

At JM elektronik, we ensure that every stage of the process is optimised and that our customers receive full cost transparency. Thanks to our experience, flexibility, and individual approach, we help bring products to market faster, safer, and more efficiently. 

Artykuł PCBA production cost – what it depends on and how we optimise it at JM elektronik pochodzi z serwisu JME.

At first glance, in-house production seems to offer full control and potential savings. In reality, however, the hidden costs and risks often outweigh the benefits – especially in today’s volatile economic environment. 

In this article, we highlight seven of the most significant and often overlooked costs of in-house production – factors that make outsourcing electronics manufacturing not only more cost-effective, but also safer and more sustainable in the long run. 

Setting up an SMT line requires millions in investment – just to get started. Advanced pick-and-place machines, reflow ovens, AOI systems, ICT and functional testers, selective soldering lines, and automated warehouses all demand significant budgets. 

What’s more, assembly equipment depreciates quickly as technology evolves. Upgrades, expansions, and replacements generate recurring expenses. For many companies, these costs remain “invisible” when compared to the seemingly simple EMS price list. 

EMS providers, however, spread investment costs across hundreds of customers. This means the end customer only pays for the actual production time used – and avoids the risk of outdated technology. 

An SMT line is not just about the machines – it also requires continuous spending on servicing, calibration, spare parts, and software licences for MES and ERP systems. 

For example, upgrading a pick-and-place programming system or servicing a reflow oven can cost as much as outsourcing the assembly of several thousand PCBs to an EMS partner. 

Unplanned downtime due to breakdowns, shortages of spare parts, or programming errors also leads to financial losses. EMS mitigates this risk with backup infrastructure and experienced service teams. 

Electronics manufacturing demands highly skilled personnel: SMT operators, process engineers, quality inspectors, warehouse staff, and often MES programmers. 

In competitive labour markets such as Poland and Germany, employee turnover is high, and the cost of training and onboarding new staff continues to rise. 

EMS providers eliminate this challenge – they maintain their own expert teams, invest in continuous training, and operate with scalable resources. This allows their customers to focus on R&D and sales instead of workforce management. 

Running in-house production means taking full responsibility for supply chain management – purchasing, logistics, forecasting, delivery control, and traceability. In times of shortages (such as the recent chip crisis), this can be a major challenge. 

EMS providers have far stronger purchasing power. Thanks to their scale, they secure preferential pricing, access to global inventories, and trusted distributor relationships. 

This not only means lower component costs, but also ensures parts authenticity, reducing the risk of counterfeits. 

At JM elektronik, one of our pillars for over 35 years has been electronic component distribution. Decades of market expertise and supplier relationships allow us to quickly source alternatives when components become unavailable. 

To meet market requirements – especially in sectors such as medical or industrial – production must comply with strict quality standards (e.g., IPC-A-610). 

Implementing these standards requires audits, quality systems, training, and continuous reporting – all of which come at a cost. 

EMS providers already operate within these frameworks. Features such as traceability, 3D AOI inspection, and advanced quality-control procedures are standard, which eliminates the need for additional staff or investment. 

Building an in-house line means taking on the risk of fluctuating production volumes. When demand drops, the line sits idle – but fixed costs like leasing, salaries, and servicing remain. 

With EMS, customers only pay for the production they actually order. Fixed costs are absorbed by economies of scale, giving companies the flexibility they need in today’s unpredictable markets. 

Launching an in-house SMT line requires months of setup, configuration, and optimisation. EMS providers, however, streamline the NPI (New Product Introduction) process – often starting production within weeks. 

In today’s fast-paced markets, shorter time-to-market can be the decisive factor between a product’s success and failure. 

Rising labour costs, supply chain pressures, geopolitical risks, and component shortages are driving more companies toward outsourcing. 

For German companies in particular, outsourcing to Poland offers a convincing advantage: lower production costs without sacrificing quality. Proximity also ensures faster delivery times, smoother communication, and the benefits of EU and Schengen integration. 

Outsourcing EMS services is far more than a price-per-board calculation – it is a strategic decision. By outsourcing, companies free up capital and resources that would otherwise be tied to running their own production lines. This enables them to focus on innovation, product development, and sales. 

Partnering with an experienced EMS provider gives access to the latest technologies, manufacturing solutions, and know-how – without the high capital investment of in-house production. Just as importantly, it significantly reduces operational and supply chain risks. 

A closer look at these seven hidden costs makes it clear: in-house production is not only more expensive, but also less flexible and riskier than outsourcing to an EMS partner. 

If you are considering optimising costs and accelerate time-to-market, it may be time to speak with an EMS partner. 

Fill out the contact form below – very often, even at the analysis stage, it becomes clear that outsourcing is not a cost, but an investment in long-term competitive advantage. 

Artykuł In-house vs EMS: 7 hidden costs of In-house Electronics Manufacturing  pochodzi z serwisu JME.

• Why does PCBA quality start even before production?
• How to avoid errors before they occur?
• Why is full traceability so crucial?
• What is the importance of advanced SMT assembly and 3D AOI inspection?
• Which tests are crucial for your device?
• How do you choose an electronics manufacturing outsourcing (EMS) partner that ensures not only on-time, but also an optimal level of quality?

In this article, we discuss how the various links in the contract manufacturing value chain translate into repeatable PCBA quality, and why the meticulousness and experience of an EMS partner should be considered a strategic factor.

In 2023, the aviation world was shaken by a case involving the supply of engine components for Airbus A320 and Boeing 737 aircraft with false technical documentation. The investigation revealed as many as 78 cases of falsified certificates. Although there were no reported incidents involving these components, the industry responded with a rapid check of records and intensive cooperation with regulators.

The case demonstrates the huge risks of inappropriate supplier selection. Even a single unverified partner can expose a company to catastrophic image and financial losses. Regardless of the sector in question, supplier selection should be treated not as a logistical step, but as an element of strategic quality management on which the success of the entire project depends.

One of the key aspects affecting the subsequent reliability of an electronic assembly (PCBA) is design with assembly realities in mind. The practice of Design for Manufacturing (DFM) allows solutions that may cause technological difficulties or increase the risk of errors to be identified at the design documentation review stage.

In the contract manufacturing process, DFM involves verifying the design in terms of component placement, distances between components and compliance with the requirements of assembly and inspection machines. Too little spacing can cause technological problems during assembly or optical inspection, while incorrect placement of test points can prevent ICT testing. Such issues are identified at the initial analysis stage, even before production starts, thus avoiding costly corrections, unexpected delays and the risk of stopping the assembly process. The aim of the analysis is to simplify production, reduce costs and ensure the highest possible quality of the final product.

As JM elektronik’s practice shows, carrying out a reliable DFM analysis makes it possible to reduce the risk of errors already in the first production run, reducing implementation time and eliminating the need for costly corrections.

This topic is discussed in more detail in the article:

DFM analysis reduces the risk of errors during production>>

The physical quality of components has a direct impact on the reliability of the entire PCBA assembly. In unstable supply chains, the risk of using components from unauthorised sources, stored in inadequate conditions or counterfeits is a significant risk. A manufacturing partner with extensive sourcing and material logistics expertise has a significant advantage in terms of quality.

JM elektronik has been active in the distribution of electronic components for more than 35 years. Through its partnerships with manufacturers of semiconductors, passive SMD components and connectors, the company has direct access to certified supply channels, which minimises the risk of counterfeit or aftermarket components. This enables full component traceability and ensures compliance with quality standards and regulations, such as REACH and RoHS directives.

Importantly, the distribution experience also translates into better flexibility to propose replacements in situations of market shortages and better purchase planning for long-term stability.

The surface mount assembly (SMT) process is one of the most sensitive stages of PCBA production. The high packing density, miniaturisation of components and variety of enclosures require precise machines and, at the same time, sophisticated inspection tools.

JM elektronik uses SMT assembly lines equipped with state-of-the-art Yamaha pick-and-place machines in the assembly process, with a total capacity of more than 110,000 components per hour. The uniform and logically consistent configuration of the individual production lines allows for optimised distribution of orders across the lines, resulting in greater flexibility  and reduced lead times.

In the SMD assembly process, the solder paste application process is critical to quality. Precise, state-of-the-art paste printers are supported by an SPI machine that controls in 3D the effect of the paste application even before the components are laid down. This ensures that defects are prevented right at the start of the process. After the reflow soldering process, the components are subjected to an automatic 3D optical inspection (AOI), which, unlike 2D inspection, enables a 3D analysis of the solder joints, identifying shortcomings, bridges, offsets or incorrect component orientation.

The advantage of AOI 3D systems is the ability to create statistical quality models to identify defect trends, which translates into continuous improvement of the assembly process.

Find out more: AOI 3D at the service of quality control>>

Optical inspection cannot detect all types of defects – especially those related to invisible internal damage, breaks in connections or electrical irregularities. Therefore, electrical and functional tests are an important supplement to the quality control process.

JM elektronik uses an appropriate combination of testing methods, ranging from in-circuit tests (ICT), HiPot safety tests, automated functional tests (FCT), sometimes carried out in climatic chambers. Each of these methods is applicable depending on the characteristics of the system.

Which test is best for your PCBA – a comparison of ICT and flying probe>>

The HiPot test, which involves applying a high voltage between paths or insulated layers, can detect micro-punctures, improper galvanic separations and potential electrical hazards to the end user. This is particularly important in mains-powered products.

HiPot tests on offer at JM elektronik>>

Automatic functional testers (FCTs), on the other hand, make it possible to run a device under near-target conditions – with power supply, input/output signals and communications. This makes it possible not to check selected functionalities of the manufactured assembly or device.

How functional testers work>>

High quality PCBA manufacturing is not the result of a single stage or technology – it is the sum of consistently executed activities that include product design, purchasing, logistics and warehousing processes, quality control plan design, assembly, testing and final inspection. The key is the process approach and the competence of the organisation at each of these levels.

Companies using EMS services should pay attention not only to price and lead time, but also to operational quality – the availability of DFM competence, supply chain transparency, inspection technologies and final testing capabilities. The experience of the EMS partner, its competence and technical background, and its ability to identify risks early have a direct bearing on the final reliability of the product.

As an experienced contract manufacturer, we take responsibility for the quality of the equipment entrusted to us, which is why at JM elektronik we attach the same importance to every part of the production process. We have been cooperating with many customers for several years. Companies satisfied with our services commission us to produce the next generation of their devices.

Take advantage of our experience and see how we can help you.

Artykuł Technical basis for quality assurance in PCBA manufacturing – a process approach in EMS practice pochodzi z serwisu JME.

A contract electronics manufacturer handles vast amounts of sensitive information—from employee and customer personal data to financial records, firmware, production recipes, development plans, and delivery schedules. Because of this, information security is not just the responsibility of the IT department; it must be a core element of the entire organization’s strategy.

Every step in the electronics manufacturing process—from design to production—contains valuable know-how, often developed over years. Breaches in data security can cause significant financial losses and damage the reputation and long-term success of the OEM.

The risk increases when design modifications are made maliciously, such as by introducing security vulnerabilities or hidden malicious code. In industries like defense, IoT, or telecommunications, even minor alterations to code or devices can open doors to espionage, hacking, or sabotage.

Unauthorized use of technological designs also leads to the market being flooded with cheap counterfeits, weakening the manufacturer’s position, cutting profits, and eroding customer trust. This risk exists whether manufacturing is done in-house or through external partners. Therefore, working within a transparent legal framework that respects intellectual property and provides clear contractual safeguards is crucial.

A trustworthy and knowledgeable EMS partner employs comprehensive legal, organizational, and technical safeguards to mitigate these risks.

By thoroughly analyzing the work environment, an airtight security system can be established across all layers—legal, organizational, and technical. Organizational maturity combined with ongoing risk assessments ensures best practices for managing clients’ intellectual property are integrated into daily operations.

Protection relies on proven technologies such as firewalls, antivirus systems, encryption of data in transit and at rest, and regular backups. Project data encryption, strict access control, supply chain security, and security audits have become essential standards to safeguard innovation and brand reputation.

Additionally, advanced tools like Data Loss Prevention (DLP) systems, multi-factor authentication (MFA), network segmentation, and IoT security are increasingly adopted. Regular audits further strengthen these defenses, creating a robust protective barrier for manufacturing and commercial operations.

Cyberattacks often result in order delays, contract breaches, and dissatisfied customers. Loss of system control can halt assembly lines instantly and block shipment of critical components.

While the immediate financial losses are severe, the erosion of partner trust can be even more damaging. In an industry where lead times and consistent quality are vital, even a brief disruption can undermine years of successful collaboration.

Building digital resilience is no longer optional—it’s essential. Without it, speed and precision in manufacturing become meaningless when systems are compromised.

Key to data security in outsourcing partnerships is eliminating unauthorized access to software and hardware during production.

Security vulnerabilities in IoT devices often arise during production, for example, through “backdoors” introduced by poorly controlled partners. That’s why securing the programming process with encryption, unique keys, and strict access restrictions is critical. Assigning access rights to specific devices, locations, or serial numbers enables precise tracking and prevents cloning.

Manufacturers must invest in preventative measures such as network segmentation, anomaly detection, regular backups, and strict employee access policies. These actions help prevent crises for both customers and manufacturers.

Confidentiality and data security are our top priorities. Every team member is bound by confidentiality agreements, and cooperation with contractors is secured through NDA clauses. These formal commitments are reinforced by internal policies and procedures.

We protect data at every stage of collaboration. Access to commercial and technical documents is strictly limited on a need-to-know basis. IT authorizations are tightly controlled and granted or revoked following clear procedures. Our systems are monitored by advanced DLP solutions and supported by robust infrastructure management, antivirus software, and multi-factor authentication. Redundant infrastructure minimizes downtime risks, while data storage in defined locations within the European Union ensures compliance with EU regulations.

Our production environment is also highly secure, featuring video surveillance and access control. We can trace every component involved in the manufacturing process. Operating under ISO 9001:2015 Certified Quality Management System standards, we guarantee the highest process quality and continuous improvement in customer satisfaction.

Data security is not just an IT issue; today’s threats demand a holistic approach involving everyone—from executives to operational teams and every employee. Data encompasses knowledge, customer relationships, know-how, and core processes—loss of which can cripple a business.

Outsourcing electronics manufacturing is a strategic decision that requires partnering with a company meeting the highest security standards. At JM Elektronik, we understand the importance of safeguarding information flow. Confidentiality is at the heart of contract manufacturing, enabling our clients to develop products and grow their businesses safely and confidently.

Choosing a manufacturer that prioritizes data security is an investment in business continuity, customer trust, and competitive advantage. A comprehensive security policy, regular training, appropriate technologies, and ongoing audits effectively minimize risk.

In our upcoming article, we will present a detailed overview of the technical foundations behind effective PCBA quality assurance.

We look forward to partnering with you!

Artykuł Your project’s security in good hands – see how JM elektronik protects your data pochodzi z serwisu JME.

Box Build refers to the complete assembly of an electronic product. It includes everything from installing pre-assembled printed circuit boards (PCBA) to integrating wire harnesses and other components into the final enclosure. This service goes beyond traditional PCBA assembly. It offers a turnkey solution that includes mechanical assembly, system integration, testing, and even final packaging.

A complete solution

These services offer a fully integrated approach to product assembly. Your EMS partner manages every stage of production – from component sourcing to final testing – all in one location. This streamlines the supply chain, accelerates the process, and eliminates the need for multiple suppliers, ensuring greater efficiency and consistency.

Precise quality control

Moreover, with all assembly processes managed by a single supplier, quality control remains consistent and rigorous. Each stage of production undergoes thorough inspection, including visual checks, SPI, AOI, X-ray, ICT testing, HiPot, FCT, and EOL. This ensures that every product meets the highest standards before leaving the facility.

Cost efficiency

Consolidating multiple assembly steps into one seamless process helps reduce labor and logistics costs, while also minimizing material waste.

Faster time to market

In addition, box Build services streamline the assembly process, accelerating product launch. This is especially crucial in industries where being first to market determines a product’s success.

Flexibility

These services are highly adaptable—whether for small prototype runs or high-volume production. We seamlessly adapt to our clients’ production needs, optimizing implementation costs without compromising quality.

Expertise & experience

Most importantly, partnering with a Box Build provider means leveraging extensive expertise in electronic manufacturing. We have gained a deep understanding of industry standards, regulatory requirements, and best practices through years of experience and close collaboration with clients. This knowledge ensures the highest quality and durability of the final product.

The Box Build service is ideal for industries requiring complex integration of electronics into enclosures and other components.

Our integrated assembly solutions are widely applied across multiple industries. In the white goods sector, this includes the production of complete devices as well as standalone control modules. For the utility metering industry, it enables the manufacturing of entire electricity, water, and gas meters. In the Smart City segment, the service supports the assembly of systems such as street lighting, LED displays, and various sensor technologies.

In the electromobility industry, these solutions are used in control modules for EV chargers, battery management systems (BMS), and communication infrastructure for charging stations. The point-of-sale (PoS) sector benefits from this service in the production of payment terminals, cash registers, and self-service kiosks. In medical electronics, it is applied in patient monitoring systems and diagnostic devices.

These capabilities are also ideal for GPS modules, fleet management systems, video recorders, control panels, smart cameras, and access control units.

As a result, the solution supports both fully assembled devices and individual control modules. This makes Box Build beneficial across all the sectors we serve.

When selecting a Box Build provider, it’s essential to evaluate their experience, technical capabilities, and quality control processes. A reliable partner will work closely with you to understand your specific requirements and deliver a tailored solution.

We bring over two decades of experience in Box Build solutions. This enables us to manage projects of any size or technical challenge. From consumer electronics to critical infrastructure control systems, our solutions meet the highest standards for both performance and aesthetics.

To ensure durability in demanding environments, we incorporate advanced chemical processes such as bonding, protective coating, and resin/silicone priming.

Additionally, we also offer the implementation of dedicated assembly lines, optimized for efficiency and minimal production waste. Thanks to our in-house distribution network, sourcing and delivering components on time is never a challenge.

Our rigorous quality control process includes SPI 3D, AOI 3D, X-ray inspections, customized inspection plans, ICT testing, dedicated functional testers (FCT), and End-of-Line testing.:

• Automatic functional testers>>
• HiPot Tests>>
• In-Circuit Tests>>

We have delivered fully assembled and packaged devices, taking full responsibility for the production process and reducing the client’s workload to a minimum. The products we have been ready for immediate placement on store shelves, allowing our clients to focus on other key aspects of their business.

To date, we have successfully delivered over 200,000 devices – and this number continues to grow. The trust of our clients is reflected in our ongoing collaboration on new generations and projects.

We have over 20 years of experience in delivering complex assembly services. This long-standing expertise gives us the flexibility to handle projects of any scale or complexity.

Interested in learning how we can support your business? Fill out the contact form below — we’ll be happy to assist you.

Artykuł Box Build solutions for end-to-end electronics manufacturing pochodzi z serwisu JME.

Manufacturing electronics in an external company is a strategic decision that is always driven by a number of factors. The most common are cost optimisation, the benefits of economies of scale, the reduction of time to market of the final product and gaining a high degree of flexibility in the area of production costs. Of course, once the terms of cooperation with a partner have been agreed, cost reduction is subject to cyclical negotiations. How can price reductions be achieved if neither the chosen materials nor the production process have changed? 

Nowadays, it is rare to attempt to lower quality requirements in order to reduce unit costs.  The times when unit cost was the most important indicator are irrevocably gone, because final customers no longer expect just a product that is attractively priced, but also one that provides adequate durability. Sustainable production methods and an appropriate image for those involved in the supply chain are also increasingly important. In an age of rapid information exchange, if a product does not meet the quality requirements, the customer will very quickly become discouraged about the brand and, through their opinions, dissuade potential customers from buying. Therefore, an illusory saving in the form of a reduction in unit cost can be counterproductive, causing a long-term decline in revenue and brand value. 

Electronics manufacturing is a complex and sophisticated process consisting of design, BOM completion, assembly and quality control and testing. Potential optimisation opportunities apply to each of these stages. 

Collaboration between the OEM’s engineers and those of the contract manufacturing service (EMS) partner can bring tangible benefits. There are often instances where a minor design change can yield significant savings. For example, adjusting the placement of individual components can allow for:

• reducing the number of processes – e.g. excluding manual soldering, 
• replacing them with more efficient ones – e.g. introducing wave soldering.

We have described these issues in detail in the article on DFM analysis>>

Experience in the industry tells us that approx. 3/4 of the costs are material costs. Optimisation of the BOM can have the best effect in the case of component groups with a particularly high proportion of the total costs. 

A large proportion of the components listed on the BOM can often be replaced by cheaper substitutes in consultation with the team responsible for designing the device. Also, unavailable components can be replaced by equivalents or other components after a slight redesign.

We have been working in the electronic components industry for almost 35 years. Using our experience and direct contacts with suppliers, we assist customers in selecting more accessible and affordable replacements for BOM components. It is good practice to include in negotiations not only engineers, but also purchasing representatives who have up-to-date knowledge of fluctuations in the electronic components market.

Through changes in the manufacturing process, labour efficiencies can be gained. The OEM’s engineers, in collaboration with the EMS partner’s engineers, should analyse the production process in depth and eliminate any bottlenecks that may affect project delays.

Depending on the type of project and scale of production, it should be considered whether it is better to work with a universal production line or whether it would be more beneficial to build a dedicated production line for the customer’s device series. Optimised set-ups, no changeovers, adjusting routes for optimum line timing reduces losses in the production process and therefore lowers the unit cost without any negative impact on quality. The work of experienced process engineers with operators makes it possible to spot activities or conditions that negatively affect labour intensity. Taking these suggestions into account provides the opportunity to make further savings in the process. 

A very important aspect for avoiding additional costs is ensuring the quality of the PCBA. At JM elektronik, we carry out a number of activities in this area. In addition to a number of organisational solutions, procedures and analyses, we naturally apply advanced control of both the correctness of the assembly and often the correctness of the operation of the device. To this end, we have implemented the following procedures: Solder Paste Inspection (SPI), Automatic Optical Inspection 3D (AOI-3D), In-Circuit Testing (ICT) and functional testing. 

The automation of production processes not only increases the accuracy of the inspection performed, but also means high reproducibility and significant savings in the time required to perform the inspection. The implementation of detailed procedures therefore allows short- and long-term savings, in the form of reduced time to market and a significant reduction in the risk of defects.  We have extensive experience in building automatic functional testers. This procedure involves reproducing the duty cycle that the assembled board will perform in the final device and simulating the operation of the final device. Such a comprehensive test radically reduces the risk of defective products reaching the market. 

In all these areas, the basis for successful cost optimisation is good cooperation between the partners. The time spent on exchanging suggestions and experiences is always less costly than the time it takes to implement improvements or, in particular, to eliminate defects.

OEMs often set annual cost reduction targets, which they see as an opportunity to make their products more competitive. As a professional EMS partner, we will do our utmost to ensure that our customers spend their money wisely. Whenever possible, and even when it seems impossible, we will find new ways to increase efficiency and savings. We feel responsible for the product we supply to you, so not every way to cut costs is acceptable to us. Nevertheless, we always find methods that are safe for your brand.

Artykuł Manufacturing electronics in an external EMS company provides additional opportunities to increase production efficiency and reduce costs pochodzi z serwisu JME.